Robnor PX804C-1 Epoxy Encapsulant


Robnor ResinLab PX804C-1 is a UL94 V-0 approved, general-purpose potting and encapsulating compound. (This product replaces the now obsolete PX804C). The epoxy encapsulant offers low shrinkage, good thermal conductivity, high adhesion and high electrical insulating characteristics.

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Robnor ResinLab PX804C-1 is a non-toxic general purpose flame retardant potting and encapsulating compound. PX804C-1 has a long usable life and may be hot or cold cured. The system exhibits good surface finish, high electrical strength, good thermal conductivity, low exotherm and low cure shrinkage. The semi flexible nature allows thermal expansion without cured stress, which makes PX804C-1 compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material, will lend itself to a wide range of applications.


  • PCB potting and encapsulation
  • Capacitors
  • Transformers
  • Deep sea electronics

Key Properties

  • High electrical insulating characteristics
  • Low shrinkage
  • Good thermal conductivity
  • High adhesion
  • UL94V-0 @ 3mm
  • Good chemical and water resistance
  • Does not contain halogens or heavy metals

Product Literature

Robnor ResinLab PX804C-1 TDS

Additional information

Weight 0.5 kg

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Manufacturer part no.

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Sold in quantity of

Mixed Viscosity (mPas)

Shore Hardness

Specific Gravity

Thermal Expansion (ppm/°C)

Flame Retardant

Thermal Conductivity (W/mk)



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