Robnor EL171LF PU Encapsulant

Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and electronic devices.

Description

Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and electronic devices.

  • Low viscosity
  • Room temperature curing
  • Flame retardant to UL94 V-0
  • Adhesion to a wide variety of substrates

Product Literature

Robnor ResinLab EL171LF TDS

Additional information

Colour

Mixed Viscosity (mPas)

Shore Hardness

Specific Gravity

Dielectric Strength (kV/mm)

Thermal Expansion (ppm/°C)

Gel Time - 150g mass (minutes)

Initial Cure (hours @ RT)

Flame Retardant

Thermal Conductivity (W/mk)

UV Stability

Temperature Range (°C)

Tg(°C)

RoHS WEEE Reach